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Jazz Semiconductor offers its customers quick and low-cost access to high
performance processes through a Multiproject Wafer (MPW) program. The Jazz MPW
program provides customers with the opportunity to prototype their upcoming designs
on one of Jazz's leading-edge technology platforms and provides the customer with
a vehicle to get new designs into the market quickly, without incurring the full
cost of a complete mask set.
Jazz
Semiconductor MPW Schedule
Updated 12/09/08
| SBC18 |
A0864 | SiGe
BiCMOS 0.18um | 9/23/2008 |
12/30/2008 | | SBC35 |
A0954 | SiGe
BiCMOS 0.35um | 9/30/2008 |
12/15/2008 | | SBC18 |
A0950 | SiGe
BiCMOS 0.18um | 10/21/2008 |
1/23/2009 | | BCD35 |
A0943 | Bi-CMOS-DMOS
0.35um | 11/4/2008 |
1/19/2009 | | SBC35 |
A0973 | SiGe
BiCMOS 0.35um | 11/11/2008 |
1/26/2009 | | SBC18 |
A0974 | SiGe
BiCMOS 0.18um | 11/18/2008 |
2/26/2009 | | BCD25 |
A0971 | Bi-CMOS-DMOS
0.25um | 12/2/2008 |
2/12/2009 | | SBC18 |
A0978 | SiGe
BiCMOS 0.18um | 12/9/2008 |
3/23/2009 | | SBC18 |
A1015 | SiGe
BiCMOS 0.18um | 1/13/2009 |
4/17/2009 | | CP05 |
A1049 | CMOS
0.5um | 2/3/2009 |
4/10/2009 | | SBC18 |
A1016 | SiGe
BiCMOS 0.18um | 2/10/2009 |
5/15/2009 | | CA18 |
A0984 | RFCMOS
0.18um | 2/17/2009 |
5/4/2009 | | SBC18 |
A1033 | SiGe
BiCMOS 0.18um | 3/10/2009 |
6/12/2009 | | SBC35 |
A1032 | SiGe
BiCMOS 0.35um | 3/17/2009 |
6/8/2009 | | SBC18 |
A1034 | SiGe
BiCMOS 0.18um | 4/14/2009 |
7/17/2009 | | BCD25 |
A1064 | Bi-CMOS-DMOS
0.25um | 4/21/2009 |
7/2/2009 | | CA18 |
A1051 | RFCMOS
0.18um | 5/5/2009 |
7/20/2009 | | SBC18 |
A1050 | SiGe
BiCMOS 0.18um | 5/19/2009 |
8/21/2009 | | SBC35 |
A1063 | SiGe
BiCMOS 0.35um | 6/9/2009 |
8/24/2009 | | SBC18 |
A1062 | SiGe
BiCMOS 0.18um | 6/23/2009 |
10/1/2009 | |
If Polyimide is needed, the published Fab-Out date will
be 5 days later | | The MPW program
runs on a monthly basis, allowing customers multiple opportunities to tape-out
their designs. Jazz will provide a customer with a 5x5mm tile for their design
(the customer can purchase multiple tiles) and offers subdicing of the tile for
an incremental charge. The customer receives approximately 50 tiles upon completion
of the MPW. NOTE: Jazz Semiconductor contracts with third parties
for purposes of performing various wafer processing, including but not limited
to such services as backgrind, bumping, dicing, epitaxy or other processing steps.
Customer agrees that Jazz Semiconductor may release the MPW wafers to such third
party contractors for performance of such services, provided that such third party
contractors are bound by an obligation of confidentiality no less restrictive
than the terms currently in place between Jazz Semiconductor and Customer and
are also under obligation to return all wafers or wafer remnants to Jazz Semiconductor
upon completion of its services. Dates are subject to change without
notice - a purchase order needs to be placed and accepted to guarantee a particular
tape-in date. 
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